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Molecular Formula: SF6
Molecular Weight: 146.05
|
Item |
National Standard |
Enterprise Standard |
|
Sulfur Hexafluoride(SF6V/V) /10 -2≥ |
99.99 |
99.999 |
|
Air (V/V) /10 -6≤ |
50.0 |
5.0 |
|
Carbon Tetrafluoride(CF4 V/V)/10 -6≤ |
15.0 |
2.0 |
|
Moisture(H2O V/V)/10 -6≤ |
8.0 |
8.0 |
|
Acidity(in HF)(HF V/V)/10 -6≤ |
1.0 |
1.0 |
|
Hydrolyzable Fluoride(in HF)(HF V/V)/10 -6≤ |
1.0 |
1.0 |
|
Other Impurity(CO2, C2F6, C3F8, SO2F2, S2OF2, S2OF10 V/V)/10 -6≤ |
15.0 |
10.0 |
|
V/V /10 -6≤ |
100 |
40 |
|
Particle |
Negotiation |
Negotiation |
Performance and Property:
It is in liquid state under normal temperature and pressure; in gas it is with no color,no smell, no toxic and no corrosion; melting point is -50℃; boiling point is -63.8℃; gas density is 6.16g/L(20℃, 0.1MPa)
Uses:
Plasma etching gas and is widely used for electronic surface cleaning
Storage:
Cool, dry and ventilated
Transportation:
GB19-73 sign and filling ratio should be less than 1.33kg/L.
Packing:
In special treated clean, dry gas cylinde and the volume is 40L, 12.5L, 10L, 8L and 4L or according to requirements